Chuck Table
Porous Ceramic Chuck Tables
Chuck Table
Main Function of Chuck Table
 Mainly used to support and chuck the
semiconductor wafer when grinding and
dici...
Chuck Table
Classification by applications
 Thinning Chucks
 Dicing Chucks
 Cleaning Chucks
 Film Uncovered Chucks
 T...
Chuck Table
Photos
 wafer
 Chuck Table
 Thinning Chucks  Dicing Chucks
 Clearance Chucks
Chuck Table
Chucks and silicon photos
 Transportation Chucks
Transportation ChucksFace side
Chuck Table
Characteristics
 High flatness and parallelism.
 Compact and uniform microstructure with high
strength.
 Go...
Chuck Table
Thinning chucks and machines
 Disco company
Disco 810 , 83H/6 , 82IF , 800series , 8000
series
 G&N company
...
Chuck Table
Disco machines
DGP 8760
Polishing machine
DFP 8140
DFP 8160
DFG
8540
DFG
8560
DAG 810
DFG 830
DFE 8060
DFG 81H...
Chuck Table
Disco 83H/6
Chuck Table
Thinning chucks with Disco machine
 Grinding processes on Disco dicing machine
 In-feed : Disco DFG
82IF/8 u...
Chuck Table
Thinning chucks matched with Disco machine
Creep: Disco DFG 83H/6 used this kind of process
Front side ,
matc...
Chuck Table
It can suck 3-8’’
silicon wafer.
Chuck Table
Disco thinning machines
Silicon thinning
machine
series
types Maximum
process size
Chucks amount grinding
proc...
Chuck Table
G&N silicon thinning machines
 G&N 300 series
 G&N 400 series
 G&N 500 series
 G&N 700 series
Chuck Table
G&N 300series
MPS 2R 300 S
MPS 2R 300 DS
MPS 2R 300 DCS
300
series
program
300series
parameters
Grinding proce...
Chuck Table
G&N 400 series
Machine
type
G&N MPS 2R 400DS
Grinding
mode
Composite feed
Wafer size 4” 、 5” 、 6” 、 8 "
Chucks...
Chuck Table
G&N 500series
Machine
type
G&N MPS T500
Grinding
mode
Vertical feed and
creep
Wafer
size
4 "~ 6 "
Chucks
numbe...
Chuck Table
G&N 700 系列
Machine type G&N MPS R700S
Grinding mode
Work table rotate, while
the spindle vertical feed
Wafer s...
Chuck Table
Korea AM thinning machine
6’’ thinning chuckVRG-250S
Chuck Table
Basic process of wafer cutting
Chuck Table
Precision parameter of dicing chuck
Material chuck size parallelism
Stainless steel and
porous ceramic
4" 2μm
...
Chuck Table
Dicing machines
 Disco company
automatic machine : 600series 、 6000series
semi-automatic : 300series 、 500ser...
Chuck Table
Disco machines
 automatic dicing machines
 600series
DFD 641 、 DFD 651 、 DFD 681 、 DFD 691
 6000series
DFD ...
Chuck Table
Chucks matched with DAD 321
Chuck Table
DAD 341 machine
Chuck Table
DFD 3350 machine and chucks
Chuck Table
DFD 6340 machine and chuck
Chuck Table
ADT machines
ADT 7100 chuck
Chuck Table
Tokyo Seimitsu company
A-WD-100A chuck
Chuck Table
Contact Us
Werlchem LLC
Wilson.wu@aol.com
http://www.chuck-table.com
San Leandro, California
of 30

Porous Ceramic Chuck Tables

Porous Ceramic Vacuum Chuck Tables
Published on: Mar 4, 2016
Published in: Business      
Source: www.slideshare.net


Transcripts - Porous Ceramic Chuck Tables

  • 1. Chuck Table Porous Ceramic Chuck Tables
  • 2. Chuck Table Main Function of Chuck Table  Mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation and so on. Silicon Wafer Chuck table
  • 3. Chuck Table Classification by applications  Thinning Chucks  Dicing Chucks  Cleaning Chucks  Film Uncovered Chucks  Transportation Chucks  Grinding Chucks
  • 4. Chuck Table Photos  wafer  Chuck Table  Thinning Chucks  Dicing Chucks  Clearance Chucks
  • 5. Chuck Table Chucks and silicon photos  Transportation Chucks Transportation ChucksFace side
  • 6. Chuck Table Characteristics  High flatness and parallelism.  Compact and uniform microstructure with high strength.  Good permeability and uniform adsorption affinity.  Long life time.  Dressing easily.
  • 7. Chuck Table Thinning chucks and machines  Disco company Disco 810 , 83H/6 , 82IF , 800series , 8000 series  G&N company G&N 300 , 400 , 500 , 700 , 940 , Multi Nano 3- 300  Strasbaugh company 7AF  Okamoto company VG401 , VG502  ACCREFECH -Tokyo Seimitsu  PG200 、 PG300  AM company VRG250S
  • 8. Chuck Table Disco machines DGP 8760 Polishing machine DFP 8140 DFP 8160 DFG 8540 DFG 8560 DAG 810 DFG 830 DFE 8060 DFG 81H/6 DFG 83H/6 DFG 82IF/8 8000 series 800 series Silicon thinning machines Silicon polishing machines IF series Creep series DFG 841 Note: our chucks can match with the machines marked with red characters.
  • 9. Chuck Table Disco 83H/6
  • 10. Chuck Table Thinning chucks with Disco machine  Grinding processes on Disco dicing machine  In-feed : Disco DFG 82IF/8 used this kind of process. Front side matched with DFG 82IF/8 Back side matched with DFG 82IF/8
  • 11. Chuck Table Thinning chucks matched with Disco machine Creep: Disco DFG 83H/6 used this kind of process Front side , matched with Disco 83H/6
  • 12. Chuck Table It can suck 3-8’’ silicon wafer.
  • 13. Chuck Table Disco thinning machines Silicon thinning machine series types Maximum process size Chucks amount grinding process 800 series DAG810 8" 1 In-feed:DFG830 8" 2 8000series DFG 8540 8" 2 DFG 8560 300mm 3 IF series DFG82IF/8 8" 4 Creep series DFG83H/6 6" 8 Creep:
  • 14. Chuck Table G&N silicon thinning machines  G&N 300 series  G&N 400 series  G&N 500 series  G&N 700 series
  • 15. Chuck Table G&N 300series MPS 2R 300 S MPS 2R 300 DS MPS 2R 300 DCS 300 series program 300series parameters Grinding process Composite feed 300S 300DCS Chucks specificat ion 4" , 5" , 6" , 8" Chucks number 5 , 3 , 2 , 1 300 DS specificat ion 4" , 5" , 6" , 8" Chucks number 8 , 5 , 4 ,
  • 16. Chuck Table G&N 400 series Machine type G&N MPS 2R 400DS Grinding mode Composite feed Wafer size 4” 、 5” 、 6” 、 8 " Chucks number 8 、 5 、 4 、 1
  • 17. Chuck Table G&N 500series Machine type G&N MPS T500 Grinding mode Vertical feed and creep Wafer size 4 "~ 6 " Chucks number 2
  • 18. Chuck Table G&N 700 系列 Machine type G&N MPS R700S Grinding mode Work table rotate, while the spindle vertical feed Wafer size 4“ 、 5” 、 6“ 、 8” 、 12 " Chucks number 30 、 20 、 14 、 7 、 3
  • 19. Chuck Table Korea AM thinning machine 6’’ thinning chuckVRG-250S
  • 20. Chuck Table Basic process of wafer cutting
  • 21. Chuck Table Precision parameter of dicing chuck Material chuck size parallelism Stainless steel and porous ceramic 4" 2μm 6" 2μm 8" 3μm 12" 10μm Note: We can make the precision according to the customers’ requirements.
  • 22. Chuck Table Dicing machines  Disco company automatic machine : 600series 、 6000series semi-automatic : 300series 、 500series 、 600series 、 3000series ADT company ADT 7100series 、 7200series ACCREFECH -Tokyo Seimitsu company ACCREFECH A-WD series
  • 23. Chuck Table Disco machines  automatic dicing machines  600series DFD 641 、 DFD 651 、 DFD 681 、 DFD 691  6000series DFD 6240 、 DFD 6340 、 DFD6450  semi-automatic  300series DAD321 、 DAD322 、 DAD341 、 DAD351  3000series DAD3230 、 DAD3350 Note: our chucks have matched with the red character machines DAD321 DAD341 DFD3350 DFD6340
  • 24. Chuck Table Chucks matched with DAD 321
  • 25. Chuck Table DAD 341 machine
  • 26. Chuck Table DFD 3350 machine and chucks
  • 27. Chuck Table DFD 6340 machine and chuck
  • 28. Chuck Table ADT machines ADT 7100 chuck
  • 29. Chuck Table Tokyo Seimitsu company A-WD-100A chuck
  • 30. Chuck Table Contact Us Werlchem LLC Wilson.wu@aol.com http://www.chuck-table.com San Leandro, California

Related Documents